Silicon Design & Testing

Deals/Contracts/Partnerships

  • 1

    An American technology company has chosen LTTS for developing safety libraries and embedded firmware implementation for its family of chipsets.LTTS will also provide software safety qualifications, CSP generation, architecture and design of software components.

    Q3(Jul-Aug-Sep), 2022

  • 2

    A leading semiconductor manufacturer has empanelled LTTS as a strategic engineering partner for a period of 3 years to offer engineering services globally to its entire product suite and assist in their digital transformation journey

    Q2(Apr-May-Jun), 2022

  • 3

    Renesas turns to AVL for functional safety. Renesas and AVL are collaborating to support for the development of ECUs that comply with ISO 26262.

    Q2(Apr-May-Jun), 2022

  • 4

    Ansys Enables Faster, More Reliable Chip Design for Juniper Networks

    Q2(Apr-May-Jun), 2022

  • 5

    Siemens collaborates with GlobalFoundries to provide trusted silicon photonics verification

    Q2(Apr-May-Jun), 2022

  • 6

    Capgemini plans to open semiconductor design services centers across Europe to support Intel?s strengthened program of chip manufacturing and ecosystem design services. Initial centers in France and Portugal will bring together chip design and embedded software teams.

    Q2(Apr-May-Jun), 2022

  • 7

    NXP Semiconductors Selects AWS as Its Preferred Cloud Provider to Power Electronic Design Automation in the Cloud

    Q4(Oct-Nov-Dec), 2021

  • 8

    GlobalLogic., Jungo and OpenSynergy announced an automotive virtual driver monitoring system (DMS) solution that integrates a standalone DMS currently provided on a separate engine control unit (ECU) with an existing automotive cockpit controller. As a result, the DMS provides input to both the instrument cluster (e.g., drowsiness trigger) and in-vehicle infotainment systems (IVIs) (e.g. gesture control) while safely and securely isolating personal data from other functionalities.

    Q4(Oct-Nov-Dec), 2021

EIIR Provider Solutions/Capabalities

  • 1

    Siemens acquires proFPGA product family from PRO DESIGN to expand industry-leading IC verification portfolio

    Q2(Apr-May-Jun), 2021

  • 2

    Tessolve expands its operations to multiple locations globally this year, including Japan, Taiwan, Thailand, Philippines, and Vietnam

    Q2(Apr-May-Jun), 2021

  • 3

    Tessolve raises $40 million from Singapore-based PE firm Novo Tellus

    Q2(Apr-May-Jun), 2021

  • 4

    QuEST Global Acquires Synapse Design to Enhance Expertise in Semiconductor and Connected Engineering

    Q2(Apr-May-Jun), 2021

  • 5

    Tessolve joins the Arm approved Design partner program to accelerate time to market for product development

    Q3(Jul-Aug-Sep), 2021

  • 6

    VVDN expands its capabilities on the Ambarella edge AI vision SoC platform to deliver next-gen vision based solutions

    Q3(Jul-Aug-Sep), 2021

  • 7

    A leading semiconductor manufacturer has awarded Wipro a turnkey silicon development contract for its 5G wireless infrastructure and Automotive Vehicle-to-everything (V2X) market. Wipro’s span expertise in very large-scale integration (VLSI) and firmware domain will help the customer develop variants of the product for different market segments and accelerate their time-to-market.

    Q4(Oct-Nov-Dec), 2020

  • 8

    Renesas and Altran Team to Deploy First Social Distancing Wristwatch that uses Ultra-Wideband Chipset with Low Rate Pulse

    Q4(Oct-Nov-Dec), 2020

  • 9

    Prodapt acquires Innovative Logic, a Silicon Valley based service provider delivering design/verification services in ASIC, FPGA, and embedded systems domains.

    Q3(Jul-Aug-Sep), 2021

  • 10

    ACL Digital joins TSMC Design Center Alliance (DCA) Program.

    Q1(Jan-feb-Mar), 2021

  • 11

    Etteplan opens up a new country, Denmark, by acquiring TekPartner, an engineering company specialized in electronics and software. TekPartner, founded 2009, covers development of all core disciplines within embedded software, intelligent electronics, FPGA (field-programmable gate array) and IoT (Internet of things). In 2019 TekPartner´s revenue was approximately 8 million euros.

    Q1(Jan-feb-Mar), 2021

  • 12

    Tessolve expands its Japanese operations as part of an international expansion plan to capitalize on its VLSI and Embedded business

    Q1(Jan-feb-Mar), 2021

  • 13

    eInfochips launches Smart Camera Reference Design based on the Qualcomm Vision Intelligence Platform using the Qualcomm QCS610 and Qualcomm QCS410

    Q4(Oct-Nov-Dec), 2021

  • 14

    Ansys Collaborates with TSMC to Deliver Thermal Analysis Solution for 3D-IC Designs

    Q4(Oct-Nov-Dec), 2021

  • 15

    QuEST Delivers Next-gen AI & Edge Computing Solutions in Japan with NVIDIA

    Q4(Oct-Nov-Dec), 2021

  • 16

    Siemens collaborates with TSMC on EDA tool certifications for TSMC’s advanced technologies

    Q4(Oct-Nov-Dec), 2021

  • 17

    Tessolve has joined the GlobalFoundries Design Enablement Network Program. Tessolve will provide design implementation services all the way through post-silicon productization.

    Q4(Oct-Nov-Dec), 2021

  • 18

    Ansys Multiphysics Solutions Achieve Certification for Samsung’s 3nm and 4nm Process Technologies

    Q4(Oct-Nov-Dec), 2021

  • 19

    Imagination’s HyperLane technology and Mobica’s application and design expertise to enhance automotive display performance and safety.

    Q4(Oct-Nov-Dec), 2021

  • 20

    LTTS has been selected as an engineering partner by Mavenir and NVIDIA, to accelerate adoption of the industry’s first converged AI-on-5G.

    Q4(Oct-Nov-Dec), 2021

  • 21

    Tessolve is now a Worldwide PDH (Preferred Design House) Partner of Infineon to provide Customer technical support and HW/SW design services on Infineon solutions

    Q4(Oct-Nov-Dec), 2021

  • 22

    eInfochips to expand Hyderabad unit. It plans to hire approximately 100 engineers in the next six months and aims to add approximately 250 engineers for the centre by FY2023. The hiring will focus on silicon design, verification and physical design.

    Q4(Oct-Nov-Dec), 2021

  • 23

    QuEST Global announced its partnership with NXP Semiconductors to deliver software support for NXP’s S32G Vehicle Network Processors. QuEST will be offering the following services for the S32G platform:Hardware System Designing and Prototyping, Automotive System Software Engineering including Design, Development and Maintenance, Integration of Connectivity Module and Features, Support NXP’s customers in achieving Functional Safety, System Validation and Automation, Product Realization

    Q4(Oct-Nov-Dec), 2021

  • 24

    Siemens has collaborated with United Microelectronics Corporation (UMC) to develop process design kits (PDKs) for the foundry‘s 110-nanometer (nm) and 180-nm BCD technology platforms.

    Q1(Jan-Feb-Mar), 2022

  • 25

    Tessolve inaugurates the Test Engineering Lab in the heart of Silicon Valley San Jose

    Q1(Jan-Feb-Mar), 2022

  • 26

    UST and Karnataka Information Technology Venture Capital Fund (KITVEN), Fund Invest in Calligo Technologies to Enable Development of POSIT-powered RISC-V Solution for HPC & AI Markets in 2022

    Q1(Jan-Feb-Mar), 2022

  • 27

    First 5G IoT Chip Combining Design in India and Make in India capabilities by Cyient, IIT H, and WiSig Networks

    Q2(Apr-May-Jun), 2022

  • 28

    Tessolve has established center in Romania to grow its strategic presence in Europe.

    Q2(Apr-May-Jun), 2022

  • 29

    Cardinal Peak joins STMicroelectronics Partner Program to accelerate customer time to market.

    Q2(Apr-May-Jun), 2022

  • 30

    Ignitarium Opens a New Office in Bengaluru, India

    Q2(Apr-May-Jun), 2022

  • 31

    Sondrel?s IP platforms prevent operational chip errors as Functional Safety is built in

    Q2(Apr-May-Jun), 2022

  • 32

    Ansys Significantly Increases Speed and Capacity of Semiconductor Signoff with Massively Scalable SeaScape Platform

    Q2(Apr-May-Jun), 2022

  • 33

    eInfochips opens its New Design Center in Indore

    Q2(Apr-May-Jun), 2022

  • 34

    Accenture Announces Intent to Acquire XtremeEDA to Expand Silicon Design Capabilities in Canada and US. Acquisition will bolster Accenture Cloud First?s edge computing capabilities.

    Q3(Jul-Aug-Sep), 2022

  • 35

    ACL Digital, an ALTEN group company, has joined the Arm Approved Design Partner (AADP) program.

    Q3(Jul-Aug-Sep), 2022

  • 36

    Siemens to establish software R&D group in Shannon. The project, which is supported by the Irish Government through IDA Ireland, is the first ?Cloud EDA? R&D group to be established by Siemens Digital Industries Software globally.

    Q3(Jul-Aug-Sep), 2022

EIIR Buyer GIC/R&D Best Practices/Solutions

Other News

  • 1

    Nanya begins construction on $10 billion DRAM fab in Taiwan for 10 nm-class process technologies. The facility will include a main fab with a double-deck cleanroom, R&D center and water recycling center.

    Q3(Jul-Aug-Sep), 2022

  • 2

    Spain plans to invest 11 billion euros ($12.4 billion) to develop microchips and semiconductors in a bid to modernize its tourism-dependent economy.

    Q2(Apr-May-Jun), 2022

  • 3

    AMD Expands Data Center Solutions Capabilities with Acquisition of Pensando for $1.9 Billion

    Q2(Apr-May-Jun), 2022

  • 4

    Intel has acquired Siru Innovations, a Finnish technology company specializing in the development of graphics IP and software services. Siru adds critical GPU talent that will support Intel?s pursuit of leadership graphics IP.

    Q2(Apr-May-Jun), 2022

  • 5

    ASML to invest $200 million to expand Connecticut facility

    Q2(Apr-May-Jun), 2022

  • 6

    Germany?s Merck to Invest USD82 Million to Build Semiconductor Plant in China

    Q2(Apr-May-Jun), 2022

  • 7

    Elest, a subsidiary of Rajesh Exports, has decided to build India's first modern display manufacturing unit in Telangana. This move includes an investment of Rs 24,000 crore to make the most advanced AMOLED displays in the state.

    Q2(Apr-May-Jun), 2022

  • 8

    Ethereum miners spent $15 billion on GPUs in the last two years about 10% of total GPU supply.

    Q2(Apr-May-Jun), 2022

  • 9

    India has $85 bn opportunity in $500 bn global semiconductor market.

    Q2(Apr-May-Jun), 2022

  • 10

    Japan?s Denso is considering a US$3 billion chip unit spinoff to tackle shortages. It is world?s fifth-largest supplier of automotive chips by sales.

    Q2(Apr-May-Jun), 2022

  • 11

    Foxconn, Vedanta to form a JV to manufacture semiconductors in India. The first major investment announcement after the government announced new PLI policy.

    Q1(Jan-Feb-Mar), 2022

  • 12

    Intel buys Tower Semiconductor for $5.4 billion to expand its foundry business on specialty products like radio frequency (RF) chips, CMOS image sensors, and power management parts.

    Q1(Jan-Feb-Mar), 2022

  • 13

    NVIDIA and SoftBank Group Announce Termination of NVIDIA’s Acquisition of Arm Limited

    Q1(Jan-Feb-Mar), 2022

  • 14

    EU announces €43bn plan to push for semiconductor independence.

    Q1(Jan-Feb-Mar), 2022

  • 15

    Sony to join TSMC on a $7 billion chip plant in Japan. 50% funding is by the Japanese Government.

    Q4(Oct-Nov-Dec), 2021

  • 16

    Bosch to invest more than 400 million euros in its semiconductor fabs in 2022

    Q4(Oct-Nov-Dec), 2021

  • 17

    Ford and GM are getting into chip development partnerships to help deal with the chip shortage.

    Q4(Oct-Nov-Dec), 2021

  • 18

    India's Tata group is in talks with three states to invest up to $300 million to set up a semiconductor assembly and test unit. An OSAT plant packages, assembles and tests foundry-made silicon wafers, turning them into finished semiconductor chips.

    Q4(Oct-Nov-Dec), 2021

  • 19

    Samsung has picked Taylor, Texas as the location for a new $17-billion plant to make advanced chips.

    Q4(Oct-Nov-Dec), 2021

  • 20

    Texas Instruments to begin construction next year on new 300-mm semiconductor wafer fabrication plants in Sherman Texas

    Q4(Oct-Nov-Dec), 2021

  • 21

    TSMC to increase prices of its chips by 10-20%. It will have a cascading effect on the prices of products in many industries.

    Q3(Jul-Aug-Sep), 2021

  • 22

    Intel announced that it could invest as much as EUR 80 billion in Europe over the next decade to boost chip capacity.

    Q3(Jul-Aug-Sep), 2021

  • 23

    Infineon opens high-tech chip factory for power electronics on 300-millimeter thin wafers

    Q3(Jul-Aug-Sep), 2021

  • 24

    AMD overtakes Intel in desktop CPU market share for the first time in 15 years.

    Q1(Jan-feb-Mar), 2021

  • 25

    Germany’s Bosch to open automotive chip factory in June.

    Q1(Jan-feb-Mar), 2021

  • 26

    Magnachip, spun off from South Korea’s SK hynix has been sold to a Chinese private equity fund for $1.4 billion. Magnachip designs and produces display driver ICs for organic light-emitting diode panels and some automotive chips, including power management ICs. The company raised $570 million in sales.

    Q1(Jan-feb-Mar), 2021

  • 27

    Why We’re in the Midst of a Global Semiconductor Shortage? 1. Demand has increased higher than expected in short term across many electronic categories, phones, computers, cars. 2. Supply of chips and parts concentrated at few nodes globally and disrupted in pandemic both production and transportation. 3. And there is hoarding somewhere for geopolitics risk. In specialized manufacturing such as semiconductor it takes some time for new supply to come up and catch up with demand.

    Q1(Jan-feb-Mar), 2021

  • 28

    Marvell Semiconductor acquires Inphi Corporation for $10 billion and augments its capability in cloud segment.

    Q4(Oct-Nov-Dec), 2020

  • 29

    What has changed in semiconductor industry in the last one year? Comparing revenue break of TSMC Q3 20 vs Q3 19 across technology, product and geo. Three major points. 1. Less than 7nm share grew from 27% to 43%. 2. HPC share grew from 29% to 37%. (More cloud?). Also automotive declining. 3. China share grew to 22% from 20%. (Hoarding before sanctions?)

    Q4(Oct-Nov-Dec), 2020

Previous Data

  • 1

    ASML opens chip-tool training center for TSMC in Taipei.

    ,

  • 2

    QuEST Global has enhanced its vision analytics and predictive maintenance solutions with Intel Edge Insights for Industrial. QuEST developed these deep learning solutions to help OEMs and Tier 1 suppliers in the industrial and semiconductor sectors to automate security and monitoring systems and manufacturing tools used for making semiconductor chips.

    ,

  • 3

    Amazon made the silicon module with MediaTek . Its AZ1 Neural Edge processor will make Alexa voice commands even faster.

    ,

  • 4

    Bosch launches 5G tests at Reutlingen wafer fab. Semiconductor production is extremely complex and sensitive. These microscopic wafers undergo more than 1,000 tests before ending up in a wide array of products. In a factory environment, electromagnetic waves can be a source of interference, so Bosch is testing the impact 5G has on production.

    ,

  • 5

    EInfochips provides SOC engineering services to Astera Labs in developing industry’s first PCIe 4.0 & 5.0 Smart Retimer SoC. The Physical Implementation services from eInfochips made possible a first-pass success for Aries PCIe® 4.0 & 5.0 Smart Retimer SoCs.

    ,

  • 6

    For the first time, it is now possible to equip traditional wristwatches with the contactless payment function. The Swiss company Winwatch integrates tiny security chips from Infineon for this purpose.

    ,

  • 7

    Intel launches 11th Gen Intel Core processors with Intel Iris Xe graphics, the world’s best processors for thin-and-light laptops, delivering up to 2.7x faster content creation, more than 20% faster office productivity and more than 2x faster gaming plus streaming in real-world workflows over competitive products.

    ,

  • 8

    MediaTek unveils Helio G95, its newest chip for premium 4G gaming smartphones.

    ,

  • 9

    MediaTek conduct world’s first public test of 5G Satellite IoT data connection with Inmarsat. MediaTek’s satellite-enabled Narrowband (NB)-IoT standard chipset tested with base station at Fucino Space Center in Italy using Inmarsat’s ’Alphasat’ Geostationary Orbit (GEO) satellite.

    ,

  • 10

    NVIDIA is buying Arm for $40 billion.

    ,

  • 11

    NXP Semiconductors announced that the first multi-device vehicle wireless charging solution driven by a single MWCT controller is now available in production vehicles. The new solution helps carmakers offer a differentiated in-car experience to their customers by enabling the passenger and driver to simultaneously charge wirelessly through one console. The use of a single MWCT device in the vehicle enables carmakers to benefit from a reduced cost and physical footprint for device charging. Based the Qi standard, it supports all Qi enabled phones, including iPhone, Samsung, Huawei, Xiaomi and others.

    ,

  • 12

    NXP announced the opening of its 150 mm (6-inch) RF Gallium Nitride (GaN) fab in Chandler, Arizona, the most advanced fab dedicated to 5G RF power amplifiers in the United States.

    ,

  • 13

    Qualcomm announced the Qualcomm Snapdragon 732G Mobile Platform, a follow-on to the Snapdragon 730G. Snapdragon 732G is designed to deliver immersive gameplay backed by smarter, faster artificial intelligence (AI) and accelerated performance, including an upgraded GPU and CPU compared to the previous generation.

    ,

  • 14

    Tessolve gets accredited by National Accreditation Board for Testing and Calibration Laboratories for competence in Testing. The accreditation comes after assessing the Reliability Lab as per the ISO/IEC 17025:2017 standard.

    ,

  • 15

    Texas Instruments announced a new custom version of the PSpice simulator from Cadence that enables engineers to simulate complex analog circuits with unlimited analysis of TI power and signal-chain products.

    ,

  • 16

    TSMC is building a new R&D center for its 2nm process. This center will have about 8000 engineers to look into the development of TSMC’s 2nm process.

    ,

Jobs

  • 1

    Synopsys Inc-Synopsys Returnship - 36755BR-Reading, England-UK-(ID-105492)
    Link

    Q3, 2022

  • 2

    Semtech-Senior Staff Validation Engineer-UK-(ID-105490)
    Link

    Q3, 2022

  • 3

    Samsung Austin Semiconductor-System Solutions Engineer-Austin, TX-USA-(ID-105483)
    Link

    Q3, 2022

  • 4

    Qurvo Inc-Sr Product Manager-Greensboro, NC-USA-(ID-105477)
    Link

    Q3, 2022

  • 5

    Onsemi-Manager, Applications-Corvallis, OR-USA-(ID-105476)
    Link

    Q3, 2022

  • 6

    Nexperia-Technology Transfer Manager-Manchester, England-UK-(ID-105486)
    Link

    Q3, 2022

  • 7

    Nexperia-Technology Transfer Engineer-Manchester, England-UK-(ID-105491)
    Link

    Q3, 2022

  • 8

    Nexperia-Engineering Director-Newport, Wales-UK-(ID-105488)
    Link

    Q3, 2022

  • 9

    Intel-Industrial IoT Solution Integrator-Phoenix, AZ-USA-(ID-105478)
    Link

    Q3, 2022

  • 10

    Intel-Automation Program Lead-Hillsboro, OR-USA-(ID-105479)
    Link

    Q3, 2022

  • 11

    indie Semiconductor-Senior Staff/Principal Product Engineer-Edinburgh, Scotland-UK-(ID-105489)
    Link

    Q3, 2022

  • 12

    Global Foundries-Deputy Director - Applications Engineering-Austin, Texas-USA-(ID-105474)
    Link

    Q3, 2022

  • 13

    Edwards Vacuum-Senior Digital & Technology Manager-Burgess Hill, England-UK-(ID-105484)
    Link

    Q3, 2022

  • 14

    Cyient-Tools Designer - Tool Support-Jupiter, FL-USA-(ID-105481)
    Link

    Q3, 2022

  • 15

    Cyient-Team Lead-Arlington, TX-USA-(ID-105475)
    Link

    Q3, 2022

  • 16

    Cyient-Saloon Mock-up Manager-Derby, England-UK-(ID-105485)
    Link

    Q3, 2022

  • 17

    Cyient-Saloon Advanced Practitioner Intercar Jumpers-Derby, England-UK-(ID-105494)
    Link

    Q3, 2022

  • 18

    Brooks Automation-Senior Systems Engineer - Vacuum Semiconductor Systems-Chelmsford, MA-USA-(ID-105482)
    Link

    Q3, 2022

  • 19

    Arm-Applications Engineer-Cambridge, England-UK-(ID-105493)
    Link

    Q3, 2022

  • 20

    Analog Devices-Principal System Applications Engineer-Norwood, MA-USA-(ID-105480)
    Link

    Q3, 2022

  • 21

    AIXTRON SE-NPI Project Manager-Cambridge, England-UK-(ID-105487)
    Link

    Q3, 2022

  • 22

    AIXTRON SE-NPI Project Manager-Cambridge, England-UK-(ID-105529)
    Link

    Q3, 2022

  • 23

    Analog Devices-Principal System Applications Engineer-Norwood, MA-USA-(ID-105522)
    Link

    Q3, 2022

  • 24

    Arm-Applications Engineer-Cambridge, England-UK-(ID-105535)
    Link

    Q3, 2022

  • 25

    Brooks Automation-Senior Systems Engineer - Vacuum Semiconductor Systems-Chelmsford, MA-USA-(ID-105524)
    Link

    Q3, 2022

  • 26

    Cyient-Saloon Advanced Practitioner Intercar Jumpers-Derby, England-UK-(ID-105536)
    Link

    Q3, 2022

  • 27

    Cyient-Saloon Mock-up Manager-Derby, England-UK-(ID-105527)
    Link

    Q3, 2022

  • 28

    Cyient-Team Lead-Arlington, TX-USA-(ID-105517)
    Link

    Q3, 2022

  • 29

    Cyient-Tools Designer - Tool Support-Jupiter, FL-USA-(ID-105523)
    Link

    Q3, 2022

  • 30

    Edwards Vacuum-Senior Digital & Technology Manager-Burgess Hill, England-UK-(ID-105526)
    Link

    Q3, 2022

  • 31

    Global Foundries-Deputy Director - Applications Engineering-Austin, Texas-USA-(ID-105516)
    Link

    Q3, 2022

  • 32

    indie Semiconductor-Senior Staff/Principal Product Engineer-Edinburgh, Scotland-UK-(ID-105531)
    Link

    Q3, 2022

  • 33

    Intel-Automation Program Lead-Hillsboro, OR-USA-(ID-105521)
    Link

    Q3, 2022

  • 34

    Intel-Industrial IoT Solution Integrator-Phoenix, AZ-USA-(ID-105520)
    Link

    Q3, 2022

  • 35

    Nexperia-Engineering Director-Newport, Wales-UK-(ID-105530)
    Link

    Q3, 2022

  • 36

    Nexperia-Technology Transfer Engineer-Manchester, England-UK-(ID-105533)
    Link

    Q3, 2022

  • 37

    Nexperia-Technology Transfer Manager-Manchester, England-UK-(ID-105528)
    Link

    Q3, 2022

  • 38

    Onsemi-Manager, Applications-Corvallis, OR-USA-(ID-105518)
    Link

    Q3, 2022

  • 39

    Qurvo Inc-Sr Product Manager-Greensboro, NC-USA-(ID-105519)
    Link

    Q3, 2022

  • 40

    Samsung Austin Semiconductor-System Solutions Engineer-Austin, TX-USA-(ID-105525)
    Link

    Q3, 2022

  • 41

    Semtech-Senior Staff Validation Engineer-UK-(ID-105532)
    Link

    Q3, 2022

  • 42

    Synopsys Inc-Synopsys Returnship - 36755BR-Reading, England-UK-(ID-105534)
    Link

    Q3, 2022

  • 43

    Intel Corporation-Global Solutions Development Manager-Chandler, AZ-United Kingdom-(ID-105065)
    Link

    Q2(Apr-May-Jun), 2022

  • 44

    Intel Corporation-Wireless Software Solutions Product Manager-Allentown, PA-United States-(ID-105063)
    Link

    Q2(Apr-May-Jun), 2022

  • 45

    Micron Technology-Director, Engineering Automation-Hyderabad, Telangana, India-India-(ID-105091)
    Link

    Q2(Apr-May-Jun), 2022

  • 46

    Micron Technology-Engineering Director, Architecture-Bengaluru, Karnataka, India-India-(ID-105093)
    Link

    Q2(Apr-May-Jun), 2022

  • 47

    Micron Technology-Manager, Mobile Systems & Software-Hyderabad, Telangana, India-India-(ID-105088)
    Link

    Q2(Apr-May-Jun), 2022

  • 48

    Micron Technology-Sr Manager - DEG Technology Operations-Boise, ID-United States-(ID-105060)
    Link

    Q2(Apr-May-Jun), 2022

  • 49

    Micron Technology-Sr. Director ? Emerging Memory Product Technology-Boise, ID-United States-(ID-105059)
    Link

    Q2(Apr-May-Jun), 2022

  • 50

    Qualcomm-5G L2-L1/ORAN Embedded development (Engr-Sr Staff)-Hyderabad, Telangana, India-India-(ID-105087)
    Link

    Q2(Apr-May-Jun), 2022

  • 51

    Qualcomm-Director Logic CAD-Bengaluru, Karnataka, India-India-(ID-105092)
    Link

    Q2(Apr-May-Jun), 2022

  • 52

    Qualcomm-Engineer-Chennai, Tamil Nadu, India-India-(ID-105090)
    Link

    Q2(Apr-May-Jun), 2022

  • 53

    Qualcomm-Sr Engineer/Sr Lead Engineer- 5G Test-Hyderabad, Telangana, India-India-(ID-105086)
    Link

    Q2(Apr-May-Jun), 2022

Silicon Design & Testing

Pareekh Jain

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